TEC Devices—Troubleshooting TEC Simulations for Unrealistically High Temperatures
Issue
An analysis containing a thermoelectric cooling (TEC) device material seems to have temperatures that are unrealistically high. The resultant temperatures fluctuate wildly, and the TEC has exceeded its maximum current.
Solution
There are two things to look for:
1. Check the setup of the TEC device parameters within the Materials task. Verify that the limiting parameters and Cold-Temperature Surface are correctly defined.
2. Ensure that the device is properly sunk to the surrounding case. If a TEC device is suspended in space with no conduction path to the ambient, temperatures can climb wildly and result in poor results.
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