The new release of Autodesk® Moldflow® Insight 2010 software contains features and enhancements that improve interoperability, 3D meshing and performance, design for sustainability, coupled 3D flow, fill+pack and birefringence simulations, and customer feedback.
These new Moldflow Insight features enable you to:
Autodesk Inventor Support |
Autodesk Moldflow Adviser Surface Mesh Export
Autodesk Moldflow Insight surface models can now be directly exported for use in Autodesk® Moldflow® Adviser software.
Direct Import of CAD Models
For Autodesk Moldflow Insight users who also have Autodesk Moldflow Design Link™ 2010, Release 2, a direct import feature is now available for native CAD geometries. This functionality allows for better and more robust meshing of CAD geometries.
Local Mesh Density Control |
New 3D Mesh Generator |
Improved 3D Temperature Solution
We've improved the accuracy of the temperature calculation in tetrahedral elements in both filling and packing analyses.
New 3D Fiber Solver
A new 3D Fiber solver offers an improved fiber orientation solution for fiber-filled thermoplastic materials when the Coupled 3D Flow solver is used.
New AMG Matrix Solver
The new Autodesk-developed AMG (algebraic multi-grid) matrix solver is generally faster and uses less RAM than the previous solver. The new matrix solver can take advantage of multicore processors and can use some graphics cards to further decrease the total time-to-solution.
Parallel Solution Technology
Parallel solution (multithreaded) technology enables the completion of multiple major computational tasks by multiple threads on a single processor, or many processors when running an analysis.
GPU Card Support
A new option to use the graphics processing unit (GPU) of some graphics cards for the Coupled 3D Flow analysis solver can result in substantially shorter analysis times. It is available on computers that have a double precision-capable, CUDA-enabled graphics card installed.
Reduced Memory Requirements and Faster Solution Times
Internal tests show that a typical analysis using an unfilled material and default process settings now requires significantly less memory and runs about 5% faster than the same analysis performed by the previous solver.
Solution TimesInternal tests show that a typical analysis using an unfilled material and default process settings now requires significantly less memory and runs about 5% faster than the same analysis performed by the previous solver.
Spectrum Correction Factor
With the Spectrum Correction Factor, you can modify the influence of viscoelastic deformations on your birefringence simulation results and improve the analysis accuracy.
Temperature Shift Model
Now you can choose the form of the Temperature Shift Model, a key part of the viscoelastic calculations inherent in birefringence simulations.
Mold Surface Temperature Profiles
Now you can set up variable mold surface temperature profiles in 3D analyses of thermoset molding processes.
Preconditioning Analysis Options
The option to perform preconditioning analysis has been extended to 3D thermoset simulations. The preconditioning analysis calculates the melt temperature of the reactive material as it starts to flow into the mold cavity.
Multiple Dispensing Passes |
The Application Programming Interface (API) offers new and improved capabilities to automate user interface functions, including:
Customer Involvement Program Autodesk now invites Moldflow Insight 2010 customers to join the Customer Involvement Program to help us identify trends and usage patterns we can use to improve your experience with our products. |
Customer Error Reporting
The new customer error reporting feature in Autodesk Moldflow Insight 2010 enables you to report to our developers if the program closes unexpectedly, to better identify and resolve software problems.
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